The HXT32410 is a low power, Direct Modulated Laser (DML) driver array for LR4 optical applications that supports data rates up to 28Gbps and optical reach up to 10km. In conjunction with a DFB laser diode array or individual DFB laser diodes, the device handles the complete digital-to-optical conversion, including CML input with equalization, laser driver, drive control and supervision.

Designed for direct DC-coupled die in TOSA applications with a small number of additional components for cost-effective and compact assemblies. Available in die form.

Key Features

  • 200mW device power dissipation when configured for:
    • IMOD = 50mAPP
    • IBIAS = 50mA
  • Supports up to: IMOD = 60mAPP & IBIAS = 80mA with VCC = 3.3V
  • Programmable Input Equalization
  • Programmable Input Signal Detect (SD) with Squelch
  • Programmable Input Polarity Inversion
  • Programmable Pulse Width Adjustment
  • Programmable Laser Modulation Current Amplitude, Peaking, and Peaking Duration
  • Integrated Temperature Sensor
  • Interrupts with User selectable Mask control
  • Laser Disable for IMOD and IBIAS
  • 2-wire interface control and symmetric pad design maximize module design flexibility
  • QSFP MSA compliant

Applications List

  • 2km LR4 datacenter modules
  • 128G Fibre Channel modules
  • InfiniBand 100GEDR optical modules
  • Proprietary multi-channel optical modules

Ordering Information

PartTemp RangePin-Package
HXT32410-DNU (Waffle Pack)-5°C to +95°CBare Die Design Size: 1300µm x 3320µm; Nominal Die Cut Size: 1350 µm x 3370 µm
HXT32410-TNU (Blue Tape)-5°C to +95°CBare Die Design Size: 1300µm x 3320µm; Nominal Die Cut Size: 1350µm x 3370µm
HXT42400EVBRoom TemperatureEvaluation Board