The HXT14450 is a Quad channel array of low power, Linear PAM4 VCSEL driver with a built in clock and data recovery unit for SR optical applications that supports signaling rates up to 28GBuad or 56Gbps PAM4. In conjunction with an individual VCSEL laser diode, the device handles the complete digital-to-optical conversion, including CML input with equalization, laser driver, drive control and supervision.

The HXT14450 also integrates a number of functions required for Automatic Power Control (APC), as well as internal and module temperature measurements and reporting. Using the included RSSI input, the module receive optical power can also be measured and reported.

Key Features

  • 275 mWper channel PDISS if configured for:
    • IMOD = 5mAPP, IBIAS = 5mA
  • Supports up to: IMOD = 15mAPP & IBIAS = 15mAwith VCC = 3.3V
  • Integrated 12-bit ADC with 6-channel analog multiplexor front-end
  • Integrated Clock and Data recovery unit
  • Programmable 8-bit IMOD and 10-bit IBIAS control
  • Integrated Bias Monitor, Transmit and Receive Power monitor capability
  • Automatic Power Control (APC)
  • Programmable Input LOS and Squelch function with disable, Transmit Disable, and Transmit Fault indication
  • Adaptive linear equalizer and decision-feedback equalizer (DFE) to cover up to 20dB lossy channel in CDR unit
  • On-chip testability; EOM, JTOL, PRBS generator/checker, local/remote loop back by integrating CDR unit
  • Integrated Temperature Sensor and input for external module temperature sensor
  • Interrupts with user selectable Mask control
  • Input and Ouput Polarity Inversion
  • Graycode encoder/decoder
  • Programmable TX test pattern generation
  • Laser Disable for IMOD and IBIAS
  • Integrated OTP for calibration
  • 2-wire interface control

Applications List

  • Up to 300M QSFP56 Ethernet modules for datacenter applications
  • Fiber Channel, InfiniBand Modules
  • 200G Ethernet SR4, 400G Ethernet SR8
  • Host side ingress and egress for CEI-56G-VSR; CEI-56G-MR

Ordering Information

PartTemperature RangeDimensions
HXT14450-DNU - Waffle Pack -40°C to +95°CBare Die Design Size: 1250µm x 4300µm; Nominal Die Size: Target: 1300µm x 4350µm
HXT14450-TNU - Blue Tape-40°C to +95°CBare Die Design Size: 1250µm x 4300µm; Nominal Die Size: Target: 1300µm x 4350µm
HXT14450EVBRoom TemperatureEvaluation Board